The evolution of interconnect technology for silicon integrated circuitry

نویسنده

  • Keith Buchanan
چکیده

Silicon integrated circuit interconnect technology has evolved rapidly, driven by the continual increase in device functional density. This paper reviews past technology developments and highlights current innovations such as the use of copper metallisation and low k dielectrics to overcome device speed limitations. Areas of convergence between silicon and compound semiconductor interconnect technologies are discussed and future requirements reviewed.

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تاریخ انتشار 2002